Via and pad structure for thermoplastic substrates and method and apparatus for forming the same
US5401911A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 1992 |
| Grant date | Mar 28, 1995 |
| Priority date | — |
| Expiry date | Apr 3, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49153
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved connection through a substrate layer is formed by embedding a conductive element such as a pin on one or more balls or spheres in a thermoplastic material which is preferably a liquid crystal polymer. The substrate may be heated to facilitate the embedding process in which material of the substrate layer is reflowed under pressure to retain the conductive element by means of a preload force. The formation of such connections with either pins or plural conductive elements allows independence of aspect ratio of the connection and, hence, feature size of conductive patterns on the substrate and the thickness of the substrate layer. Perfecting features of the substrate and method and apparatus for forming the substrate, embedding to a selected depth to form protrusions and recesses to assist in registration of a substrate layer with another substrate layer, metallization to form pads, improved connection between metallization patterns on the substrate and the conductive elements, the regulation of pressurization of substrate material by means of differently shaped dimples or a renewable surface and several alternative arrangements for positioning and embedding the conductiv…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.