Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices
US5401983A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1993 |
| Grant date | Mar 28, 1995 |
| Priority date | — |
| Expiry date | Apr 7, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0217
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Various novel lift-off and bonding processes (60, 80, 100) permit lift-off of thin film materials and devices (68), comprising In.sub.x Ga.sub.1-x As.sub.y P.sub.1-y where 0<x<1, and 0<y<1, from a growth substrate (62) and then subsequent alignable bonding of the same to a host substrate (84). As a result, high quality communication devices can be fabricated for implementing a three dimensional electromagnetic communication network within a three dimensional integrated circuit cube (10), an array (90) of optical detectors (98) for processing images at very high speed, and a micromechanical device (110) having a platform (114) for steering or sensing electromagnetic radiation or light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.