Multi-modular device for wet-processing integrated circuits
US5402807A · kind A · utility
11Cited by
7References
6Claims
0Family size
Inventors
Key dates
| Filing date | Jul 21, 1993 |
| Grant date | Apr 4, 1995 |
| Priority date | — |
| Expiry date | Jul 21, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
This invention relates to an improved automatic processing system and process for handling delicate objects in a controlled, low particulate atmosphere, and an improved method for constructing such apparatus. This system is particularly useful in the wet processing of semiconductor wafers, integrated circuits and similar delicate electronic devices. This invention also relates to semiconductor wafers, integrated circuits and similar delicate electronic devices produced by the above processing system and process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.