Particle size distribution for controlling flow of metal powders melted to form electrical conductors
US5403376A · kind A · utility
4Cited by
21References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 1994 |
| Grant date | Apr 4, 1995 |
| Priority date | — |
| Expiry date | Jun 30, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S428/901
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electrical conductors on printed circuit board substrates are made from metal particles having a particular particle size range distribution used to control the flow of molten metal when entering the liquid phase such as during fusing. The distribution can follow a bimodal curve wherein the mixture contains approximately 45% by weight of large copper particles between 44-74 microns, 45% by weight of small copper particles less than 5 microns in size with the remaining 10% by weight being particles with sizes between the smaller and larger sizes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.