Patent · US Expired

Process for through-hole plating of two-layer circuit boards and multilayers

US5403467A · kind A · utility

57Cited by

1References

5Claims

0Family size

Assignee

BAYER HEALTHCARE LLC · DE

Inventors

Friedrich Jonas · Aachen, DE
Gerhard D. Wolf · Dormagen, DE

Key dates

Filing date	Jan 19, 1993
Grant date	Apr 4, 1995
Priority date	—
Expiry date	Jan 19, 2013

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0796
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A process for through-hole plating of two-layer circuit boards and multilayers using polythiophenes as a conductive agent on the side walls of through-holes for the direct through-hole plating and to the circuit boards and multilayers thus produced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.