Integrated circuit substrate with cooling accelerator substrate
US5403783A · kind A · utility
32Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1993 |
| Grant date | Apr 4, 1995 |
| Priority date | — |
| Expiry date | Dec 16, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes an integrated circuit device, the integrated circuit device comprises a first substrate including an integrated electronic semiconductor circuit and a second substrate including a cooling accelerator for accelerating a heat energy exchange between the integrated electronic semiconductor circuit and a cooling fluid, and the second substrate is joined fixedly with the first substrate through a covalent bond formed between the first substrate and the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.