Application specific integrated circuit and placement and routing software with non-customizable first metal layer and vias and customizable second metal grid pattern
US5404033A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 1993 |
| Grant date | Apr 4, 1995 |
| Priority date | — |
| Expiry date | Dec 23, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/90
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An embodiment of the present invention is a customizable integrated circuit including a basic cell diffusion of four transistors in a substrate. A first metallization layer includes a plurality of connective strips that electrically connect to the basic cell by a plurality of contacts. A second metallization layer, after a first patterning and chemical etch, comprises an orthogonal matrix of conductors that are electrically connected to corresponding connective strips by a plurality of vias that are respectively positioned at an intersection of orthogonal conductors. A second patterning and chemical etch of the second metallization layer configures the basic cell according to a user's specification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.