Reflow soldering apparatus
US5405074A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1993 |
| Grant date | Apr 11, 1995 |
| Priority date | — |
| Expiry date | Jul 20, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a soldering apparatus comprising: a soldering chamber; transporting means for transporting the objects to be soldered through the soldering chamber; and heating means for heating the objects to be soldered in the soldering chamber, wherein the heating means are formed by means for feeding heated gas to the chamber. A simple device is thus obtained which heats uniformly. Such an apparatus can be embodied in both closed and open form. According to one of the preferred embodiments the means for feeding heated gas are formed by at least one heating unit, wherein the heating units are each formed by a fan and at least one heating device, for instance an electrical heating filament, connected forwardly thereof. Cooling units can also be used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.