Patent · US Expired

Dual composition coupler for modular medical implants

US5405394A · kind A · utility

107Cited by
9References
8Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJun 17, 1993
Grant dateApr 11, 1995
Priority date
Expiry dateJun 17, 2013

Classification

  • Technology area (CPC A)Human Necessities
  • CPC primaryA61F2310/00892
  • WIPO fieldMedical technology
  • WIPO sectorInstruments

Abstract

The invention provides an interpositional coupler for inserting between modules of a modular medical implant, wherein the modules are fabricated of compositions having different electrochemical potentials, to reduce or prevent the flow of a galvanic current and thereby reducing or preventing this contribution to corrosion of the prosthesis. The coupler may be of an insulative type comprising a zirconium/zirconium alloy core coated with blue-black zirconium oxide or nitride or any metal coated with amorphous diamond-like carbon. Alternatively, the coupler may be of a dual composition type with each of the compositions having essentially the same electrochemical potential as the module to which it couples.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.