Method of etching aluminum foil
US5405493A · kind A · utility
13Cited by
3References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 26, 1994 |
| Grant date | Apr 11, 1995 |
| Priority date | — |
| Expiry date | Jan 26, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12472
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of etching increases the surface area of a metal foil by creating uniformly distributed etch tunnels. The foil is pretreated by depositing a discontinuous surface layer of metal that is cathodic to the foil, followed by chemically etching the foil to remove a portion of the deposited metal. Finally, the foil is electrochemically etched to create the etch tunnels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.