Insulating adhesive tape, and lead frame and semiconductor device employing the tape
US5406124A · kind A · utility
252Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 29, 1993 |
| Grant date | Apr 11, 1995 |
| Priority date | — |
| Expiry date | Nov 29, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An insulating adhesive tape which comprises a base supporting film and an adhesive layer formed on at least one surface thereof, said adhesive layer being formed of a thermoplastic polymer comprising a thermoplastic polyimide, wherein said thermoplastic polymer has a glass transition temperature ranging from 180.degree. C. to 280.degree. C. and an elastic modulus ranging from 10.sup.10 dyne/cm.sup.2 to 10.sup.11 dyne/cm.sup.2 at 25.degree. C., said modulus including a value ranging from 10.sup.2 dyne/cm.sup.2 to 10.sup.9 dyne/cm.sup.2 at a temperature between 250.degree. C. and 300.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.