Apparatus and method for testing bare dies with low contact resistance between the die and testing station
US5406210A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 3, 1993 |
| Grant date | Apr 11, 1995 |
| Priority date | — |
| Expiry date | Feb 3, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07307
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A bare die testing apparatus comprising a multilayer interconnection structure 10 having a testing station 11 for testing the bare die 20, testing circuits and components 12 arranged in said structure adjacent the testing station 11, said testing station 11 having a plurality of microbumps 17 of conductive material soldered onto wettable metallization pads 18 located on interconnection trace terminations of the interconnection structure, said terminations being connected through the interconnections of the multilayer structure to said testing circuits and components 12. The microbumps 17 are distributed in a pattern corresponding to the pattern of contact pads 19 on a bare die 20 to be tested. A method of testing bare dies by the bare-die testing apparatus embodying the invention, the method including optically aligning the contact pads 19 of a bare die 20 under test with the microbumps 17 of the testing station 11, contacting the aligned contact pads 19 of the bare die 20 with the corresponding microbumps 17 of the testing station 11 and applying appropriate pressure on to bare die 20 to ensure desired low contact resitstance between the microbumps 17 and the contact pads 14.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.