Printed circuit board having tapered contact pads for surface mounted electrical components
US5406458A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 10, 1993 |
| Grant date | Apr 11, 1995 |
| Priority date | — |
| Expiry date | Dec 10, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (23) having a plurality of solder coated contact pads (24, 26) for the surface mounting of electrical components (10.sup.1) thereon. Each pad (24, 26) has a rectangular portion and a triangular portion extending in the direction of the component's body (18) so as to reduce the amount of solder (28) located under the body (18) while not disadvantageously affecting the tolerance with which connector caps (20, 22) of the components (10.sup.1) can be mounted on, and bonded to, the pads (24, 26). This arrangement inhibits the formation of solder droplets on the printed circuit board (23) during the bonding process. At least one of the components fixed to the connector pads has an elongated electrically insulating body portion provided at its ends with connector portions which are respectively bonded to the connector pads. The dimension of the rectangular portion of each pad which is at right angles to the longitudinal axis of the associated component is less than the transverse dimension of the associated connector portion of the associated component. The connector portions of the electrical component extend over and are soldered to parts of both the rectangular …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.