Thermal barrier for hot glue adhesive dispenser
US5407101A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 29, 1994 |
| Grant date | Apr 18, 1995 |
| Priority date | — |
| Expiry date | Apr 29, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C5/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus (10) for dispensing hot melt adhesives includes an air gap (100) in the adhesive manifold (16) of the dispenser (10). The apparatus (10) includes a heater (80), a temperature sensing device (RTD) (82) and adhesive passageway (84) located within the adhesive manifold (16) of the dispenser (10). The dispenser (10) delivers heated adhesive to a gun body (12) where it is applied to a substrate. The air gap (100) is interposed between the heater (80) and the adhesive passageway (84) and directs a majority of the heat generated by the heater (80) toward the gun body (12) and toward regions of the apparatus (10) needing additional heating. The air gap (100) enables a desired temperature gradient within the dispenser (100) to be maintained and prevents localized heating or cooling, thus decreasing the possibility that the adhesive will coagulate and plug the dispenser (10).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.