Patent · US Expired

Hotmelt bonding process

US5407517A · kind A · utility

13Cited by
3References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 15, 1991
Grant dateApr 18, 1995
Priority date
Expiry dateMar 15, 2011

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08G2170/20
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

The invention relates to a process for bonding surfaces with isocyanate-containing prepolymers having an isocyanate group content of less than 1.8% by weight, based on the prepolymer, and an average molecular weight MW.sub.n of at least 4,500 in which (a) the prepolymers are prepared by the reaction of (i) polyester diols prepared from dodecanedioic acid and even-numbered alkane diols containing at least 6 carbon atoms and (ii) diisocyanates; (b) the prepolymer is applied as a hotmelt adhesive at a temperature of 80 to 160.degree. C. by spin-spraying onto at least one surface to be bonded; and (c) the treated surface is brought into intimate contact with a second surface to be bonded.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.