Hotmelt bonding process
US5407517A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 1991 |
| Grant date | Apr 18, 1995 |
| Priority date | — |
| Expiry date | Mar 15, 2011 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a process for bonding surfaces with isocyanate-containing prepolymers having an isocyanate group content of less than 1.8% by weight, based on the prepolymer, and an average molecular weight MW.sub.n of at least 4,500 in which (a) the prepolymers are prepared by the reaction of (i) polyester diols prepared from dodecanedioic acid and even-numbered alkane diols containing at least 6 carbon atoms and (ii) diisocyanates; (b) the prepolymer is applied as a hotmelt adhesive at a temperature of 80 to 160.degree. C. by spin-spraying onto at least one surface to be bonded; and (c) the treated surface is brought into intimate contact with a second surface to be bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.