Process to fabricate thick coplanar microwave electrode structures
US5407787A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 1993 |
| Grant date | Apr 18, 1995 |
| Priority date | — |
| Expiry date | Jun 18, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A process for making thick metal structures on a substrate has the steps of: selectively exposing a thick layer of photoresist disposed on a substrate to ultraviolet radiation including the 350 nm to 450 nm portion of tile spectrum of a mercury vapor lamp, where the photoresist layer is a heat-treated arid hydrated photoresist layer, to fully pattern the substrate: developing the patterned substrate by contacting the photoresist layer with a photoresist developing solution; exposing the photoresist layer to a plasma for hardening the pattern against thermal flow; hardbaking the photoresist pattern on the substrate; plating the metal onto the patterned substrate using a low current density (J) during at least part of the plating process, making a thick methyl structure on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.