Compositions containing hollow microspheres
US5407983A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 10, 1994 |
| Grant date | Apr 18, 1995 |
| Priority date | — |
| Expiry date | Feb 10, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A composition is described with comprises a mixture of PA1 (A) from about 5% to about 60% by weight of at least one water-insoluble polymer; PA1 (B) from about 1% to about 30% by weight of inorganic or synthetic resinous hollow microspheres; and PA1 (C) from about 20% to about 70% of at least one volatile organic liquid which is a solvent for the polymer of (A). The compositions also may contain (D) at least one solid particulate inorganic filler. Adhesive compositions such as solvent cements prepared in accordance with the present invention are characterized as low V(olatile) O(rganic) C(hemical) compositions wherein the VOC is, for example, less than 500 or even less than 400 grams per liter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.