Manufacture of semiconductor devices and novel lead frame assembly
US5408126A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 17, 1993 |
| Grant date | Apr 18, 1995 |
| Priority date | — |
| Expiry date | Dec 17, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame assembly comprises a lead frame having cantilevered leads. Combined with the lead frame is a rigid, elongated base member having a U-shaped cross-section and laterally outwardly extending flanges at the upper ends of side walls of the base member. The leads of the lead frame overlie the base member flanges and are bonded to conductive paths on the flanges which extend along the flanges, along the base member side walls and onto the bottom wall of the base member. In use, a semiconductor chip is mounted on the bottom wall and wire bonded to respective ones of the conductive paths. Two base members can be used in flange-to-flange contacting relationship to provide a tubular enclosure for the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.