Electronic circuit assembly with optical waveguide for interconnecting electronic components
US5408567A · kind A · utility
19Cited by
7References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 1, 1993 |
| Grant date | Apr 18, 1995 |
| Priority date | — |
| Expiry date | Dec 1, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0274
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming an electronic circuit assembly in which channels are formed in a surface of a circuit board e.g. by excimer laser drilling, and then filled with an optically transmissive resin material, to form an optical waveguide structure. A number of electronic devices are mounted on the circuit board, at least some of the devices including optical receiver and/or transmitter means for receiving/transmitting optical signals from/to the waveguide. An optical fibre is coupled to the waveguide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.