Process for the manufacture of integrated capacitive transducers
US5408731A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1993 |
| Grant date | Apr 25, 1995 |
| Priority date | — |
| Expiry date | Nov 5, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The process notably consists of assembling by welding by means of a connecting layer (16) a first (10) and a second substrate (12) of a semiconductor material, of thinning the second substrate (12) and, for each of the transducers, of structuring this second thinned substrate (12) to form a network of orifices (24) and of defining the contour of the fixed electrode of the transducer, of etching the first substrate (10) to form the diaphragm (28) of the transducer, and of eliminating the part of the connecting layer (16) which is located between the diaphragm (28) and the network of orifices (24) to separate this diaphragm (28) from the fixed electrode. The invention has applications in the manufacture of transducers such as microphones.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.