Vibrational self aligning parts in a solder reflow process
US5409155A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Apr 23, 1993 |
| Grant date | Apr 25, 1995 |
| Priority date | — |
| Expiry date | Apr 23, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for soldering areas of two parts together such as solder leads of an electronic component to the solder pads on a printed circuit board which includes the step of raising the temperature of the abutting areas to a value greater than the melting temperature of the solder and while at the elevated temperature, vibrating the parts to align (center) the areas with respect to one another. Accordingly a reflow oven designed to practice this invention includes a conveyor system with three continuous belts leading in series from the entrance to the exit of the oven. The first belt carries the parts through a temperature zone where melting of the binder occurs; the second belt carries the parts through a hotter zone where melting of the solder and vibration to effect centering occurs; the third belt carries the part through the cooling zone. Separation of the belt into three isolated sections prevents disturbance of the parts when they are located in areas where the solder is not molten.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.