Polyamides having a low water absorptivity

US5410015A · kind A · utility

Assignee

• BASF SE

Inventors

• James Hurley · Mannheim, DE
• Walter Goetz · Ludwigshafen, DE
• Gerd Blinne · Worms, DE

Key dates

• Filing date: Jul 6, 1993
• Grant date: Apr 25, 1995
• Expiry date: Jul 6, 2013

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08K5/13
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic polyamide molding materials contain, as essential components, PA0 A) from 39 to 99% by weight of a polyamide or a mixture of different polyamides and PA0 B) from 1 to 30% by weight of a phenol of the general formula I EQU R.sub.3 E I PA0 and E is a trivalent, aliphatic, C.sub.1 -C.sub.10 -hydrocarbon radical, triazinetriyl or a trivalent C.sub.6 - or C.sub.10 -aryl radical, and PA0 c) from 0 to 60% by weight, based on the amount of polyamide, of fibrous or particulate fillers or a mixture thereof.