High density semiconductor device having inclined chip mounting
US5410182A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1993 |
| Grant date | Apr 25, 1995 |
| Priority date | — |
| Expiry date | Jun 22, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a rectangular COB substrate body, a die pad on the surface of the substrate body, a plurality of outer leads at the periphery of the substrate body, a plurality of wiring patterns on the surface of the substrate body connected to corresponding outer leads, a plurality of inner leads on the surface of the substrate body surrounding the die pad, connected to corresponding outer leads by the corresponding wiring patterns, and arranged in a substantially rectangular shape having sides, each respectively forming a predetermined acute angle with respect to a corresponding side of the substrate body whereby intervals between adjacent wiring patterns are longer than a predetermined length, a semiconductor chip having a plurality of electrode pads and mounted on the die pad, and a plurality of wires establishing electrical connections between the plurality of electrode pads of the semiconductor chip and corresponding inner leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.