Internal wiring structure of a semiconductor device
US5410450A · kind A · utility
26Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1992 |
| Grant date | Apr 25, 1995 |
| Priority date | — |
| Expiry date | Dec 3, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49433
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
External lead-through terminals of a semiconductor device, such as a power transistor module, are internally wired to a circuit assembly by a wiring block consisting of one or more conductive lead frames interposed between the lead-through terminals and the circuit assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.