Method for attaching a shield
US5411199A · kind A · utility
7Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 1994 |
| Grant date | May 2, 1995 |
| Priority date | — |
| Expiry date | Mar 7, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/34
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for attaching a shield (102) to a an electronic assembly (116) having a heat sink (110) includes applying solder on the inner walls (104) of the shield (102). Next, the shield (102) is placed over the electronic assembly (116) such that the electronic assembly (116) is covered by the shield (102) and the shield (102) is in mechanical contact with the heat sink (110). Then, the shield (102) and heat sink (110) are heated so that the solder on the inner walls (104) of shield (102) flows and solders the shield (102) to the heat sink (110).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.