Pressure-sensitive adhesives
US5412035A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1992 |
| Grant date | May 2, 1995 |
| Priority date | — |
| Expiry date | Aug 12, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Pressure-sensitive adhesive (PSA) compositions containing a crystalline polymeric additive having an M.sub.w of less than 25,000 and a melting point (T.sub.a) greater than 23.degree. C., preferably 30.degree. to 60.degree. , and PSA composites of a backing, preferably a flexible backing, with such a PSA composition coated thereon. The presence of the additive causes the PSA to lose adhesive strength when heated to T.sub.a. The base resin of the PSA is preferably a polyacrylate or a styrene/butadiene copolymer. The additive, which is preferably present in amount 1 to 35%, e.g. 5 to 30%, is preferably a side chain crystallizable (SCC) polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.