Apparatus and method for cooling electronic devices
US5412535A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 1993 |
| Grant date | May 2, 1995 |
| Priority date | — |
| Expiry date | Aug 24, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49353
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat transfer assembly 11 is disclosed for transferring heat from a heat generating electronic device 15 or computer chip to ambient air. The heat transfer assembly 11 is comprised of a heat pipe 20 mounted perpendicular to a heat generating electronic device 15. The heat transfer assembly 11 is designed to provide a mechanically solid support for the bonding of the various heat transfer assembly components and to use circumferentially mounted fins 23 to increase the efficiency of heat transfer away from the electronic devices 15. The heat transfer assembly can function effectively when mounted in any direction. Thermocouples 42 are used to monitor the temperature and efficiency of the heat generating electronic device 15 such that corrective action can be initiated if the device begins to overheat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.