Wafer cooling device
US5413167A · kind A · utility
44Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 1994 |
| Grant date | May 9, 1995 |
| Priority date | — |
| Expiry date | Apr 28, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer cooling device includes a wafer chuck; a heat exchanger having an internal structure for circulation of cooling water therethrough; and a flexible heat pipe for providing heat communication between the wafer chuck and the heat exchanger.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.