Integrated socket and IC package assembly
US5413489A · kind A · utility
37Cited by
13References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 27, 1993 |
| Grant date | May 9, 1995 |
| Priority date | — |
| Expiry date | Apr 27, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package for demountable attachment to a printed circuit board or like device is formed from an integrated assembly of an IC chip and socket, The IC chip is permanently mounted to a chip carrier which spreads the contact area from a first area to a larger second area. The chip carrier or spreader is contained in a plastic socket formed of a cover and a base. The base has an array of apertures therethrough each of which is equipped with wadded wire/plunger contacts for conformal contact with both pads on the bottom of the chip carrier and pads on a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.