Resistance heated, sealed microfabricated device package method and apparatus

US5414214A · kind A · utility

Assignee

• Motorola, Inc. · US

Inventors

• Frederick Y. Cho · Scottsdale, US
• Michael J. Anderson · Phoenix, US
• Howard D. Knuth · Tempe, US

Key dates

• Filing date: Jun 27, 1994
• Grant date: May 9, 1995
• Expiry date: Jun 27, 2014

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus (105, 301) for enclosing a microfabricated component (225) includes a package base (120, 405, 910), a package lid (110, 510, 950) and a seal (215) coupled to the package base (120, 405, 910) and to the package lid (110, 510, 950). The apparatus (105, 301) further includes a conductive loop (210, 610, 920) thermally coupled to the seal (215). Electrical energy is supplied to the conductive loop (210, 610, 920) to heat the conductive loop (210, 610, 920) and seal (215) to melt the seal (215) and thereby to seal the package base (120, 405, 910) to the package lid (110, 510, 950), providing a sealed environment for the microfabricated component (225).