Multilayer IC semiconductor package
US5414222A · kind A · utility
25Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 1993 |
| Grant date | May 9, 1995 |
| Priority date | — |
| Expiry date | Aug 17, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An improved multilayer integrated circuit package. The package, which has a plurality of layers of conducting leads, has metal vias which connects leads in a first layer connected to leads in a second layer. The improvement comprises having at least on of the vias with a cross-section such that the via is much larger in a first direction than in a second direction generally perpendicular to the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.