Heat transforming arrangement for printed wiring boards
US5414592A · kind A · utility
48Cited by
7References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 17, 1994 |
| Grant date | May 9, 1995 |
| Priority date | — |
| Expiry date | Aug 17, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1404
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In the present invention, a heat transferring arrangement is disclosed for a printed wiring board assembly. A heat conductive panel is provided to be in close proximity to a component side of a printed wiring board. The heat conductive panel further includes flange members, so that the flange members may be forced against a heat conducting surface of a chassis and provide a thermally conductive contact therewith. With this arrangement, heat transfer by radiation from the circuit components to the heat conductive panel is enhanced and thereby permits heat transfer by conduction from the heat conductive panel to the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.