Method and apparatus for in-process analysis of polycrystalline films and coatings by x-ray diffraction
US5414747A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1994 |
| Grant date | May 9, 1995 |
| Priority date | — |
| Expiry date | Jan 31, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N23/207
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An accurate, real-time method for monitoring and analyzing crystalline specimens having polycrystalline platings. The method is capable of individual or simultaneous analysis of any combination of the following: 1) composition of the substrate and plating (even when the plating and substrate having common elements); 2) analysis of thickness of the plating(s); 3) analysis of the depth of the plating(s), e.g., the thickness of any overlay; 4) analysis of the crystalline phase depth simultaneous with phase composition; 5) the preferred crystalline orientation; 6) the strain in the substrate; and (7) crystallinity and grain size. The apparatus is similar to that of U.S. Pat. No. 5,148,458 issued to Ruud, with the apparatus of this invention having the several detectors placed on different arcs and/or radial distances from the specimen surface under investigation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.