Hybird packaging of integrated I/O interface device and connector module
US5415556A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 6, 1993 |
| Grant date | May 16, 1995 |
| Priority date | — |
| Expiry date | Dec 6, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S439/925
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A connector module for connecting at least one of an input device and an output device to a multi-wire bus including a first stage supporting the multi-wire bus, a second stage having an IC chip mounted on a lead frame, the lead frame including first electrical connections for connecting the input and output devices to the IC chip and second electrical connections including a plurality of stamped metal contacts that are bent with one end formed for an insulation displacement contact with multi-signals between the multi-wire bus and the input and output devices, and a stage fastener for interlocking the first stage to the second stage. Also disclosed are a first plurality of conductive patterns for connecting the input and output devices to the IC chip, and a second plurality of conductive patterns for connecting the multi-wire bus to the IC chip the second plurality of conductive patterns including button contacts for conveying signals between the multi-wire bus and the input and output devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.