Award mounter
US5415723A · kind A · utility
Inventor
Key dates
| Filing date | Mar 30, 1994 |
| Grant date | May 16, 1995 |
| Priority date | — |
| Expiry date | Mar 30, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1744
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A die assembly for holding a bas-relief military decoration to a ribbon while gluing the two together. The die assembly has mating top and bottom halves, and sandwiches both the ribbon and the decoration therewithin. The decoration is placed in a die which conforms to the front, or visible side, so as to hold the same immovably. The die is held in a recess formed in the bottom half. The ribbon is placed in a slide groove located in the top half. Glue is applied to the exposed rear surface of the decoration. The two halves are then pressed together, and the ribbon and decoration are also pressed together, and united. Precise alignment of the decoration and ribbon, and between die assembly upper and lower halves, is provided by cooperating guides formed in the die assembly. A hole is formed in the top half, to accommodate prongs formed in the decoration. This enables retention of these prongs, rather than requiring bending them back or removing them prior to mounting the decoration. In a preferred embodiment, a separate cap member provides a storage chamber. Bottom half, top half, and the cap member frictionally interfit by cooperating channels and flanges, so that the die assembly f…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.