Patent · US Expired

Production of micromoldings having a high aspect ratio

US5415977A · kind A · utility

4Cited by

6References

5Claims

0Family size

Assignee

BASF SE

Inventors

Thomas Wuensch · Bad Dürkheim, DE
Peter Hoessel · Schifferstadt, DE
Gerhard Hoffmann · Otterstadt, DE
Juergen Langen · Bonn, DE

Key dates

Filing date	Aug 5, 1993
Grant date	May 16, 1995
Priority date	—
Expiry date	Aug 5, 2013

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S430/168
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A process for the production of micromoldings having a high aspect ratio by imagewise irradiation of a polymer with high-energy, parallel radiation from an X-ray source employs, as the polymer, a homo- or copolyoxymethylene.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.