Method for making semiconductor heat-cooling device having a supporting mesh
US5416046A · kind A · utility
Inventor
Key dates
| Filing date | Jan 18, 1994 |
| Grant date | May 16, 1995 |
| Priority date | — |
| Expiry date | Jan 18, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N10/17
Abstract
A method for manufacturing semiconductor heat-cooling devices. A semiconductor heat-cooling device has a plurality of semiconductor chips, an upper ceramic layer and a lower ceramic layer. By means of a supporting mesh between the upper layer and the lower layer, the semiconductor chips can be fixed and soldered to the conductive films on the inner surfaces of the two ceramic layers. The method not only increases the manufacturing yield rate and production throughput but also prevents moisture generated during the cooling process from entering the space between the ceramic layers. Short circuiting of semiconductor chips can also be avoided and the efficiency of the device can be maintained. By adding a sealing body to the edges of the supporting mesh, the space between the two ceramic layers is sealed. Erosion of and damage to the semiconductor chips is thus effectively minimized and the service life of the device is prolonged.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.