Radiation curable hot melt pressure sensitive adhesives
US5416127A · kind A · utility
32Cited by
19References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1994 |
| Grant date | May 16, 1995 |
| Priority date | — |
| Expiry date | Jan 26, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2170/40
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention is a hot melt pressure sensitive adhesive formed by copolymerizing acrylic, or a combination of acrylic and vinyl, monomers with the functional monomer, 1-(1-isocyanato-1-methyl ethyl)-3-(1-methyl ethenyl)benzene m-TMI, to give a saturated polymer with pendant vinyl groups that are crosslinked by UV or EB radiation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.