Method of bonding and bonding compositions
US5416142A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 20, 1994 |
| Grant date | May 16, 1995 |
| Priority date | — |
| Expiry date | May 20, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A method of adhesively bonding or welding a first plastic surface to a second plastic surface is described which comprises the steps of: PA1 (I) applying to the first surface or second surface or both surfaces, a composition which is free of hollow microspheres and comprises a mixture of PA2 (A) from about 5% to about 60% by weight of at least one water-insoluble polymer selected from ABS, PVC, CPVC or mixtures thereof; PA2 (B) from about 1% to about 60% by weight of at least one water-insoluble polymer selected from acrylic polymers, vinyl aromatic polymers and vinylpyrrolidone polymers; and PA2 (C) from about 10% up to about 90% by weight of at least one volatile organic liquid which is a solvent for polymers (A) and (B); PA1 (II) contacting the first surface with the second surface; and PA1 (III) allowing the adhesive composition to form a bond or weld between the first surface and the second surface. The invention also relates to compositions which comprise a mixture of components (A) through (C) as defined above.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.