Cicuit and process of manufacturing the circuit

US5416277A · kind A · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Herbert Zimmermann · Freiberg am Neckar, DE
• Klaus Steinle · Sindelfingen, DE
• Kurt Spitzenberger · Laichingen, DE
• Guenther Stecher · Leonberg, DE

Key dates

• Filing date: Mar 18, 1993
• Grant date: May 16, 1995
• Expiry date: Mar 18, 2013

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/09909
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

In a process for manufacturing a circuit including a first circuit plane of a ceramic substrate which is covered with, for example, thick-film structures and is imprinted with corresponding conductor paths having contact faces, the ceramic substrate is to be connected with a second circuit plane composed of a green tape substrate.