IC card including frame with lateral hole for injecting encapsulating resin
US5416358A · kind A · utility
67Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 1993 |
| Grant date | May 16, 1995 |
| Priority date | — |
| Expiry date | Sep 16, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/812
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC card includes: a circuit board on which functional components are mounted; and a frame covered with a thin plate, the circuit board being disposed in the frame, the inside of the frame being filled with a foamed resin. As a result of the above arrangement, an IC card having a strong resistance to various external forces is produced. Furthermore, because it is possible to incorporate a surface material with a design in an integrally molded device, thus it is also possible to produce an IC card device having an excellent appearance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.