Interconnection method and apparatus
US5417577A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 26, 1993 |
| Grant date | May 23, 1995 |
| Priority date | — |
| Expiry date | Jul 26, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved electrical connection between each of a set of metallized areas (16) on a first substrate (11 ) and those on a second substrate (12), via a layer of anisotropically conductive material (22) sandwiched therebetween, is obtained by arraying the metallized areas in concentric rings about each of a plurality of fasteners (28) extending through both substrates and the material. By arraying the metallized areas in concentric rings about each fastener, the anisotropically conductive material in contact with the metallized areas arrayed in each ring will advantageously be subjected to a uniform pressure by the fastener, improving the conductivity of the material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.