Dry exhaust gas conditioning
US5417934A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1993 |
| Grant date | May 23, 1995 |
| Priority date | — |
| Expiry date | Jan 26, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02C20/30
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A gas treatment method and apparatus for use in connection with processes of etching semiconductor devices or of plasma enhanced chemical vapor deposition onto semiconductor materials. In accordance with the method and apparatus, the exhaust gases are introduced into first and second stages while heating the first and second stages. The stages can be contained within a heated cartridge. The first stage contains silicon or a silicon-rich alloy or a silicon-rich substance in a particulate form and a partial coating of copper or a copper rich substance in intimate contact with the silicon, the silicon-rich alloy or the silicon-rich substance. The second stage contains calcium oxide, a calcium oxide containing material, or a soda lime containing medium.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.