Adhesive, waterproof and hydrolysis-resistant bonding layer for metal, ceramic, glass, polymer-plastic bonds and dispersion for producing it
US5418262A · kind A · utility
8Cited by
6References
15Claims
0Family size
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Key dates
| Filing date | Aug 20, 1993 |
| Grant date | May 23, 1995 |
| Priority date | — |
| Expiry date | Aug 20, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J4/06
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A dispersion for producing an adhesive, waterproof and hydrolysis-resistant bonding layer for bonding metal, ceramics, glass and for polymer-plastic bonds, including a phenol resin-methacrylate dispersion containing phenol with free methylol groups, one or more mono- or multifunctional methacrylate compounds, dispersed acrylate, water and acetone.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.