Soldering apparatus with adapted soldering tower
US5419482A · kind A · utility
4Cited by
4References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 30, 1993 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | Dec 30, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a soldering apparatus comprising: a vessel for liquid solder; at least one soldering tower placed in the vessel for causing liquid solder to leave the soldering tower on the upper side, wherein the soldering tower is adapted to cause the liquid solder to run off on all sides; a conveyor for carrying objects for soldering along the top side of the soldering tower such that the objects for soldering come into contact with the liquid solder; and a cover for maintaining an atmosphere with a reduced oxygen content at least in the surrounding area of the liquid solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.