Mounting apparatus for ball grid array device
US5419710A · kind A · utility
Inventor
Key dates
| Filing date | Jun 10, 1994 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | Jun 10, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1076
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Ball grid array devices are mounted in a burn-in and test socket which has a top surface with windows for the ball terminals depending from the ball grid array device. Contact fingers mounted on the base of the socket extend through a cam plate and into the windows from the opposite side of the top surface. When the cam plate is moved laterally with respect to the top surface, the ends of the contact members are moved into contact with the ball terminals. The ends of the contact members are curved to contact the ball terminals between the center of the ball terminal and the surface of the ball grid array device, thus retaining the device in the socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.