Stress reduced insulator
US5419787A · kind A · utility
3Cited by
16References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 24, 1994 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | Jun 24, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C8/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An insulating film with low thermal expansion characteristics is formed by depositing aluminum alloy materials in thin film form without the use of high temperatures and which can then be oxidized to create an insulating film which has low stress. A mixture of aluminum and magnesium oxides, known as spinel, has the proportions which are approximately correct for zero expansion when crystallization results from the oxidation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.