Method for manufacturing a three-dimensional circuit apparatus
US5419806A · kind A · utility
83Cited by
5References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 25, 1994 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | Jan 25, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for producing a three-dimensional circuit apparatus, wherein substrates that are arranged above one another are firmly joined to one another by depressions in the adjoining surfaces of the neighboring substrates. The depressions are filled with a mixture of two metal constituents, one being a liquid and the other being a solid and the solid constituent dissolves in the liquid constituent, which leads to the hardening of the mixture, and firmly joins the depressions to one another due to the hardening of the mixture. In addition, detached components are arranged on prepared substrate wafers and are firmly joined thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.