Curing agents/accelerators, curable compositions and processes
US5420223A · kind A · utility
17Cited by
8References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 19, 1993 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | Oct 19, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/686
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Described are several preferred acid salts and complexes of N,N-dimethylpyridine (DMAP) and 4-(4-methyl-1-piperidinyl)pyridine (MPP) which are useful as curing agents or as accelerators in preferred epoxy resin curing processes. Also described are particularly preferred processes for forming cured epoxy resin materials which are advantageously employed in large production line scale operations, and curable coating compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.