Printed circuit board/chassis grounding apparatus and methods
US5420378A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1994 |
| Grant date | May 30, 1995 |
| Priority date | — |
| Expiry date | Jul 14, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To facilitate a grounding connection between a circuit board and a chassis upon which it is to be mounted, a spaced series of unlined mounting holes are formed through the substrate portion of the circuit board between its top and bottom sides, and spaced series of grounding vias are formed through the substrate and positioned in a circular arrays around each of the mounting holes. Annular layers of a metallic plating material are formed on the opposite sides of the circuit board substrate, around the top and bottom ends of the unlined mounting holes, with the plating material being extended along the interior side surfaces of the vias between associated top and bottom annular plating material layers. Using solder masks placed on the opposite sides of the circuit board substrate, circular arrays of solder pads are formed on the outer side surfaces of the annular plating layers, with each solder pad array being interdigitated with the vias in one of the circular arrays thereof, and being horizontally offset from the vias. The bottom side of the circuit board is secured against a side of the chassis by extending metal mounting screws through the unlined mounting holes of the circuit …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.